MultiQ

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MultiQ Integrated Circuit (IC) offers a large set of configurations and security features. From companies manufacturing smart cards to integrators offering various applications, MultiQ brings a flexible alternative for smart card, label and ticket based systems.

MultiQ is an easy-to-integrate solution available on contact, contactless or dual interface EAL5+ high and EMVCo certified Integrated circuit. This native Operating System is ported on a range of chip permitting to access different user memory sizes, functions and cryptographic methods (DES, 3DES, AES, RSA** & ECC**).

APPLICATIONS

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ENTREPRISE SECURITY

MULTIQ as identification badge

Permits to control building access and perform advanced access management. Guards can also verify photo, name or fingerprint with a dedicated phone application.

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BANKING & PAYMENT

MULTIQ as e-Passport | e-National ID | Driving licence | Health document

Allows to electronically verify document authenticity and people identity. Comply with European Machine-Readable Travel Document Standard (Doc 9303)

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BANKING & PAYMENT

MultiQ as Bank | Loyalty | Member | Music festival or sport card

Enables secure payment scheme using EMV-CPA application on EMV terminals. Permits to store event tickets & perform micro-payment.

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TRANSPORT

MultiQ as Transportation card | ticket
Allows to store e-ticket or verify subscription validity with CALYPSOTM | CLAPTM |CI- PURSETM

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MARKETING

MultiQ as Loyalty | Customer | Member card
Permits to implement Loyalty scheme or verify member credentials

MULTIQ FEATURES

FILE SYSTEM

ISO/IEC 7816-4

COMMUNICATION

ISO/IEC 7816-3 | T=0/1

ISO/IEC 14443 A/B
DATA STRUCTURE
ISO/IEC 7816
ICAO TrLDS1.7
ISO/IEC 18013 (2019)
SYMMETRICAL CRYPTOGRAPHY

DES | 3DES | AES

ASYMMETRICAL CRYPTOGRAPHY

RSA up to 4096 -bit**
ECC up to 521-bit**

  • 4-Stages Lifecycle manager
  • Transport Key protection
  • Anti-tearing
  • Anti-collision
  • Transaction protection
  • Detection of fraudulent chips

Coil on Module (Infineon)

CONFIGURATION

PACKAGING

MULTIQ

ISO/IEC 7816-4

WAFER

Sawn wafer

ICAO / MRTD

ICAO DOC 9303

CONTACT

6-pins | 8-pins module

NFC

NDEF | SECURE NDEF

CONTACTLESS

250 μm | 350 μm module

CIPURSE ™

OSPT | CIPURSE ™

PVC | extended life PVC prelaminates

EMV *

EMV 4.2 | CPA | SDA

Polycarbonate prelaminates

DUAL INTERFACE

Coil on Module (Infineon)

Inductive technology (SPS)

SECURITY FEATURES

Ask the card holder to enter a PIN CODE for sensitive information access
Ensure confidentiality and data integrity with SECURE MESSAGING
Perform MATCH-ON-DEVICE using fingerprints, face or iris
Up to 8 different keys per application
Electronic Signature **
Key pair on-board generation **

ICAO SECURITY PROTOCOLS

Basic Access Control (BAC)
Passive Authentication (PA)
Active Authentication (AA) **
Supplemental Access Control (SAC)
Extended Access Control (EAC) **
Password Authenticated Connection Establishment (PACE) **